Kinesys Overview
KINESYS Software offers products for the Semiconductor Test, Assembly and Packaging industry to meet the automation challenges of today and tomorrow.
Our flagship product is the Assembly Line Production Supervisor (ALPS).
Semiconductor devices are manufactured on wafers. These devices are singulated from the wafer and assembled into a package, possible with other devices, on a strip. Then the packaged devices are singulated and placed in trays. The raw devices on the wafer and the packaged sevices on the strips and in the trays are periodically tested and inspected. Keeping track on the results of these test and inspection results and passing them forward to the next process step is the primary focus of ALPS. This information is stored in the form of wafer, strip or tray maps or, more generically, substrate maps.
This was previously accomplished by marking the devices with ink dots. The latest packaging technologies are intolerant of such ink dots. Electronic mapping (sometimes called inkless assembly) is not only clean it allows for multiple speed/quality binning which increases the value that can be extracted from the devices.
Another capability offered by ALPS is single device tracking (SDT). It is possible with ALPS to trace back the exact manufacturing environment experience by an individual device that may have failed at final test or even out in the field. In the case of field failures, it is possible to contain the extent of a product recall with potentially huge cost savings.
Customers can rely on ALPS to manage their mission critical map data. ALPS has become the leading solution in the industry for inkless assembly single device tracking.
Click here for the latest news.
Our flagship product is the Assembly Line Production Supervisor (ALPS).
Semiconductor devices are manufactured on wafers. These devices are singulated from the wafer and assembled into a package, possible with other devices, on a strip. Then the packaged devices are singulated and placed in trays. The raw devices on the wafer and the packaged sevices on the strips and in the trays are periodically tested and inspected. Keeping track on the results of these test and inspection results and passing them forward to the next process step is the primary focus of ALPS. This information is stored in the form of wafer, strip or tray maps or, more generically, substrate maps.
This was previously accomplished by marking the devices with ink dots. The latest packaging technologies are intolerant of such ink dots. Electronic mapping (sometimes called inkless assembly) is not only clean it allows for multiple speed/quality binning which increases the value that can be extracted from the devices.
Another capability offered by ALPS is single device tracking (SDT). It is possible with ALPS to trace back the exact manufacturing environment experience by an individual device that may have failed at final test or even out in the field. In the case of field failures, it is possible to contain the extent of a product recall with potentially huge cost savings.
Customers can rely on ALPS to manage their mission critical map data. ALPS has become the leading solution in the industry for inkless assembly single device tracking.
Click here for the latest news.
Wafer mapping for reliable inkless assembly
Substrate map data management
600+ map format converters available
600+ map format converters available
Add a SEMI GEM/SECS Host interface to your equipment
Interfaces available to many leading equipment suppliers
Worldwide sales, service and support centers